Precision Grinding

Profiled roller


我公司采用优质天然金刚石及CVD为磨料,国际领先结合剂配方及烧结工艺,使用进口专用设备及检测仪器生产仿型滚轮,适配于各种数控磨齿机床;该滚轮轮廓精度高、高效耐磨,是高效磨削修整的最佳工具;加工的产品精度一致性好,表面质量高而稳定,能显著提高生产效率和产品质量,降低制造成本;特别适合高精度、大批量生产。高精度要求磨床加工:气门、万向节、轴承内外圈、曲轴、凸轮轴、精密齿轮等领域的磨削加工。规格:外径—

Chamfering grinding wheel


CurrentlyintheLEDindustry,mostsemiconductorcircuitsarefabricatedonshallowsurfacelayersofsapphiresubstratematerials.Duetotherequirementsofthemanufacturingprocess,thehighdimensionalprecision,geometricprecision,edgeprecision,etc.ofthewaferarehighlydemanded.Itisusuallynecessarytochamfertheedgeofthewaferbeforethechipisthinned.Thisprocessisoftenreferredtoasedgechamfering,andthecorrespondingequipmentisachamferingmachine.Ourchamferinggrindingwheelismainlyusedforthechamferingofsemiconductorwafers.Theprocessedobjectsinclude:integratedcircuitsubstratesiliconwafers,sapphireepitaxialwafers,siliconwafers,galliumarsenide,GaNwafers,etc.Theapplicationprocessmainlyincludes:edgechamfering.OurCompany’sgroovedwheelspecifications:a).Specifications:diameter53mm/105mm/151mm/202mm,etc.;single-groove,double-groove,multi-grooveupto12grooves.b)Particlesize:230/270,400/500,500/600c).Endingrunout:≤0.04mmd).Excirclerunout:≤00.05mme).Dynamicbalancecriteria:G1ThegrindingwheelproducedbyourCompanycanbeusedforhigh-speedandhigh-efficiencygrinding,alsohaslongservicelifeandhighcostperformance,thuscancompletelyreplacetheimportedproducts.Withthehighmaterialremovalefficiencyandhighfinish,itcanreducethecostsofthechamferingprocessbyabout30%.Atpresent,ithasbeenappliedinmanyLEDenterprisessuchasQingdaoiStar-Wafer,HarbinQiuguan,DaqingJiachang,TDGHolding,TangshanJingyuanElectronics,NanjingJ-crystal,FujianJing’an,etc.,andrecognizedbythecustomers.OurCompanycandesignandproduceallkindsofsuper-hardgrindingwheelproductsfordifferentuserequirementsanduseenvironment,andprovideyouwithsatisfactoryservices!

Thinning grinding wheel


ThethinninggrindingwheeliswidelyusedinthefieldsofLEDchips,integratedcircuitsiliconwafers,etc.oftheelectronicsindustry,andismainlyusedforthinningandgrindingofsemiconductorwafers.Theprocessedobjectsinclude:discretedevices,integratedcircuitsubstratesiliconwafers,sapphireepitaxialwafers,siliconwafers,galliumarsenide,GaNwafers,silicon-basedchips,etc.Theapplicationprocessmainlyincludes:roughgrindingprocessingandfinishingprocessingofbackthinningandfrontgrinding. OurCompany’sthinninggrindingwheelspecifications:a).Specifications:diameter200mm/250mm/265mm/280mm/300mm/380mm,etc.;wecanalsodesignandmanufactureavarietyofsingle-ring,multi-ring,obliquetooththinninggrindingwheelaccordingtocustomerneeds. b).Particlesize:230/270,270/325,400/500,600/700; c).Endingrunout:≤0.04mm d).Excirclerunout:≤0.05mm e).Dynamicbalancecriteria:G1ThegrindingwheelproducedbyourCompanyhashighprocessingefficiency,shallowscratchmarks,thingrindingdamagelayer,excellentprocessingquality,andlongservicelife,whichcanreducethecostsofthegrindingprocessbyabout30%.Atpresent,ourproductshavereplacedtheimportedproductsofmanycustomers. Customeractualusagedata: 1.TheLN-297DseriesgrindingwheelsinglesheetmatchedwiththeNTSgrindercangrindabout18,000piecesof2-inchsubstratepiece,andabout5,000piecesof4-inchsubstratepiece; 2.TheLG-255DseriesgrindingwheelsinglesheetmatchedwiththeGALAXYgrindercangrindabout2,000piecesof4-inchsubstratepiece; 3.TheLS-304DseriesgrindingwheelsinglesheetmatchedwiththeSPEEDFAMgrindercangrindabout5,000piecesof4-inchsubstratepiece.KoreanNTS,JapaneseSHUWA,JapaneseDISCO,TaiwaneseWEC,AmericanENGIS,etc.
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