Precision Grinding
目前在led行业中，套料钻广泛用于led上游产业。首先晶体在长晶炉中成型，后用掏料钻取出符合相应规格的晶棒。我公司的套料钻砂轮主要应用于半导体材料晶棒的掏取。我公司掏料钻砂轮规格a).规格:直径2,4,6英寸及非标规格b).粒度:60-120目c).最大进给速度25mm/min(2英寸)d).转速100-800r/min（依据不同直径）e).加工长度6-12m（依据不同直径）f).同心度公差≤0.
Crystal grinding and finishing is an important process in the processing of semiconductor materials. Parallel grinding wheels are mainly used in the process of crystal excircle or plane finishing, realize the characteristics including the stable processing size, material layer free from sharpening, stable processing quality, long service life, etc. This product has been stably used in Japanese, German and domestic grinding machines, and has unique advantages in rough grinding and fine grinding.
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