Precision Grinding
CurrentlyintheLEDindustry,mostsemiconductorcircuitsarefabricatedonshallowsurfacelayersofsapphiresubstratematerials.Duetotherequirementsofthemanufacturingprocess,thehighdimensionalprecision,geometricprecision,edgeprecision,etc.ofthewaferarehighlydemanded.Itisusuallynecessarytochamfertheedgeofthewaferbeforethechipisthinned.Thisprocessisoftenreferredtoasedgechamfering,andthecorrespondingequipmentisachamferingmachine.Ourchamferinggrindingwheelismainlyusedforthechamferingofsemiconductorwafers.Theprocessedobjectsinclude:integratedcircuitsubstratesiliconwafers,sapphireepitaxialwafers,siliconwafers,galliumarsenide,GaNwafers,etc.Theapplicationprocessmainlyincludes:edgechamfering.OurCompany’sgroovedwheelspecifications:a).Specifications:diameter53mm/105mm/151mm/202mm,etc.;single-groove,double-groove,multi-grooveupto12grooves.b)Particlesize:230/270，400/500,500/600c).Endingrunout:≤0.04mmd).Excirclerunout:≤00.05mme).Dynamicbalancecriteria:G1ThegrindingwheelproducedbyourCompanycanbeusedforhigh-speedandhigh-efficiencygrinding,alsohaslongservicelifeandhighcostperformance,thuscancompletelyreplacetheimportedproducts.Withthehighmaterialremovalefficiencyandhighfinish,itcanreducethecostsofthechamferingprocessbyabout30%.Atpresent,ithasbeenappliedinmanyLEDenterprisessuchasQingdaoiStar-Wafer,HarbinQiuguan,DaqingJiachang,TDGHolding,TangshanJingyuanElectronics,NanjingJ-crystal,FujianJing’an,etc.,andrecognizedbythecustomers.OurCompanycandesignandproduceallkindsofsuper-hardgrindingwheelproductsfordifferentuserequirementsanduseenvironment,andprovideyouwithsatisfactoryservices!
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