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LED And Semiconductor

Machining

Precision Glass Processing

Processing Of Solar Single And Polycrystalline Silicon

Precision Grinding

Parallel grinding wheel

Parallel grinding wheel

Crystal grinding and finishing is an important process in the processing of semiconductor materials. Parallel grinding wheels are mainly used in the process of crystal excircle or plane finishing, realize the characteristics including the stable processing size, material layer free from sharpening, stable processing quality, long service life, etc. This product has been stably used in Japanese, German and domestic grinding machines, and has unique advantages in rough grinding and fine grinding.
Thinning grinding wheel

Thinning grinding wheel

ThethinninggrindingwheeliswidelyusedinthefieldsofLEDchips,integratedcircuitsiliconwafers,etc.oftheelectronicsindustry,andismainlyusedforthinningandgrindingofsemiconductorwafers.Theprocessedobjectsinclude:discretedevices,integratedcircuitsubstratesiliconwafers,sapphireepitaxialwafers,siliconwafers,galliumarsenide,GaNwafers,silicon-basedchips,etc.Theapplicationprocessmainlyincludes:roughgrindingprocessingandfinishingprocessingofbackthinningandfrontgrinding. OurCompany’sthinninggrindingwheelspecifications:a).Specifications:diameter200mm/250mm/265mm/280mm/300mm/380mm,etc.;wecanalsodesignandmanufactureavarietyofsingle-ring,multi-ring,obliquetooththinninggrindingwheelaccordingtocustomerneeds. b).Particlesize:230/270,270/325,400/500,600/700; c).Endingrunout:≤0.04mm d).Excirclerunout:≤0.05mm e).Dynamicbalancecriteria:G1ThegrindingwheelproducedbyourCompanyhashighprocessingefficiency,shallowscratchmarks,thingrindingdamagelayer,excellentprocessingquality,andlongservicelife,whichcanreducethecostsofthegrindingprocessbyabout30%.Atpresent,ourproductshavereplacedtheimportedproductsofmanycustomers. Customeractualusagedata: 1.TheLN-297DseriesgrindingwheelsinglesheetmatchedwiththeNTSgrindercangrindabout18,000piecesof2-inchsubstratepiece,andabout5,000piecesof4-inchsubstratepiece; 2.TheLG-255DseriesgrindingwheelsinglesheetmatchedwiththeGALAXYgrindercangrindabout2,000piecesof4-inchsubstratepiece; 3.TheLS-304DseriesgrindingwheelsinglesheetmatchedwiththeSPEEDFAMgrindercangrindabout5,000piecesof4-inchsubstratepiece.KoreanNTS,JapaneseSHUWA,JapaneseDISCO,TaiwaneseWEC,AmericanENGIS,etc.
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