Precision Grinding
At present, Daotian Precision mainly produces precision grinding tools for LED and semiconductor industries, precision glass, solar monocrystalline silicon and polycrystalline silicon processing, as well as related precision grinding tools for machining and auto parts processing. The production capacity is up to 1,500 pieces/month. Its main product lines include: thinning grinding wheel, nesting drill, chamfering grinding wheel, profiled roller, parallel grinding wheel, grinding disc, and so on.
目前在led行业中，套料钻广泛用于led上游产业。首先晶体在长晶炉中成型，后用掏料钻取出符合相应规格的晶棒。我公司的套料钻砂轮主要应用于半导体材料晶棒的掏取。我公司掏料钻砂轮规格a).规格:直径2,4,6英寸及非标规格b).粒度:60-120目c).最大进给速度25mm/min(2英寸)d).转速100-800r/min（依据不同直径）e).加工长度6-12m（依据不同直径）f).同心度公差≤0.
Crystal grinding and finishing is an important process in the processing of semiconductor materials. Parallel grinding wheels are mainly used in the process of crystal excircle or plane finishing, realize the characteristics including the stable processing size, material layer free from sharpening, stable processing quality, long service life, etc. This product has been stably used in Japanese, German and domestic grinding machines, and has unique advantages in rough grinding and fine grinding.
Itadoptstheuniquehigh-performancefinepolymerbindertechnologyandthehigh-gradediamondofthecoatingprocesstoproducethefinegrindingdiscproductsfortheglasswareandhandicraftgrindingprocess-themouthfinishing,achievesthecharacteristicsincludingthehigh-speedgrinding,smoothmouthwithoutblasting,andevenanduniformgrindingquality,etc.,replacesthedisadvantagesofthesandpapergrindingprocesssuchasthehighreplacementfrequency,badlyflyingdust,unstablegrindingquality,etc.;alsomakesuniquecontributionsandsupportforcreatingfineglasswareandhandicraftsandpromotingtheproductlevels,andwinsthepraisesfromextensivecustomers.Thefinegrindingdiscrealizestheimprovementofthemouthqualityinallaspects.Itisasupergrindingtoolwithhighperformancefinepolymerbinder,andahigh-technewmaterialproduct.Itsmanufacturingprocesshasastrongtechnicalinnovation,andtheresultinghighefficiencyandhighqualityhaveinjectedthehigh-techcreativityintothetraditionalutensilsprocessing,andtheresultingcleanproductionandsavingproductionespeciallyshowgreatsocialbenefits.Productspecifications:Model1.Highprecision,highefficiencygrinding2.Greatlyreducenon-workinghours3.Highdurability,longservicelife4.Simpletrimming,availableforonlinetrimming5.GoodworkingenvironmentThediamondgrindingdisc,afterbeingresearchedanddevelopedfortwoyears,nowhasbeenrapidlypromotedinenterprisessuchasShanxiDahua,ChengdeHuafu,ZiboJintian,etc.Amongthem,ShanxiDahuaisthefirsttousecomprehensively.Eachofitsbrancheshasadiamondgrindingdiscrunningonline,andhastakentheleadinenjoyingtherichbenefitsbroughtbyhightechnology.
我公司采用优质天然金刚石及CVD为磨料，国际领先结合剂配方及烧结工艺，使用进口专用设备及检测仪器生产仿型滚轮，适配于各种数控磨齿机床；该滚轮轮廓精度高、高效耐磨，是高效磨削修整的最佳工具；加工的产品精度一致性好，表面质量高而稳定，能显著提高生产效率和产品质量，降低制造成本；特别适合高精度、大批量生产。高精度要求磨床加工：气门、万向节、轴承内外圈、曲轴、凸轮轴、精密齿轮等领域的磨削加工。规格：外径—
CurrentlyintheLEDindustry,mostsemiconductorcircuitsarefabricatedonshallowsurfacelayersofsapphiresubstratematerials.Duetotherequirementsofthemanufacturingprocess,thehighdimensionalprecision,geometricprecision,edgeprecision,etc.ofthewaferarehighlydemanded.Itisusuallynecessarytochamfertheedgeofthewaferbeforethechipisthinned.Thisprocessisoftenreferredtoasedgechamfering,andthecorrespondingequipmentisachamferingmachine.Ourchamferinggrindingwheelismainlyusedforthechamferingofsemiconductorwafers.Theprocessedobjectsinclude:integratedcircuitsubstratesiliconwafers,sapphireepitaxialwafers,siliconwafers,galliumarsenide,GaNwafers,etc.Theapplicationprocessmainlyincludes:edgechamfering.OurCompany’sgroovedwheelspecifications:a).Specifications:diameter53mm/105mm/151mm/202mm,etc.;single-groove,double-groove,multi-grooveupto12grooves.b)Particlesize:230/270，400/500,500/600c).Endingrunout:≤0.04mmd).Excirclerunout:≤00.05mme).Dynamicbalancecriteria:G1ThegrindingwheelproducedbyourCompanycanbeusedforhigh-speedandhigh-efficiencygrinding,alsohaslongservicelifeandhighcostperformance,thuscancompletelyreplacetheimportedproducts.Withthehighmaterialremovalefficiencyandhighfinish,itcanreducethecostsofthechamferingprocessbyabout30%.Atpresent,ithasbeenappliedinmanyLEDenterprisessuchasQingdaoiStar-Wafer,HarbinQiuguan,DaqingJiachang,TDGHolding,TangshanJingyuanElectronics,NanjingJ-crystal,FujianJing’an,etc.,andrecognizedbythecustomers.OurCompanycandesignandproduceallkindsofsuper-hardgrindingwheelproductsfordifferentuserequirementsanduseenvironment,andprovideyouwithsatisfactoryservices!
ThethinninggrindingwheeliswidelyusedinthefieldsofLEDchips,integratedcircuitsiliconwafers,etc.oftheelectronicsindustry,andismainlyusedforthinningandgrindingofsemiconductorwafers.Theprocessedobjectsinclude:discretedevices,integratedcircuitsubstratesiliconwafers,sapphireepitaxialwafers,siliconwafers,galliumarsenide,GaNwafers,silicon-basedchips,etc.Theapplicationprocessmainlyincludes:roughgrindingprocessingandfinishingprocessingofbackthinningandfrontgrinding. OurCompany’sthinninggrindingwheelspecifications:a).Specifications:diameter200mm/250mm/265mm/280mm/300mm/380mm,etc.;wecanalsodesignandmanufactureavarietyofsingle-ring,multi-ring,obliquetooththinninggrindingwheelaccordingtocustomerneeds. b).Particlesize:230/270,270/325,400/500,600/700; c).Endingrunout:≤0.04mm d).Excirclerunout:≤0.05mm e).Dynamicbalancecriteria:G1ThegrindingwheelproducedbyourCompanyhashighprocessingefficiency,shallowscratchmarks,thingrindingdamagelayer,excellentprocessingquality,andlongservicelife,whichcanreducethecostsofthegrindingprocessbyabout30%.Atpresent,ourproductshavereplacedtheimportedproductsofmanycustomers. Customeractualusagedata: 1.TheLN-297DseriesgrindingwheelsinglesheetmatchedwiththeNTSgrindercangrindabout18,000piecesof2-inchsubstratepiece,andabout5,000piecesof4-inchsubstratepiece; 2.TheLG-255DseriesgrindingwheelsinglesheetmatchedwiththeGALAXYgrindercangrindabout2,000piecesof4-inchsubstratepiece; 3.TheLS-304DseriesgrindingwheelsinglesheetmatchedwiththeSPEEDFAMgrindercangrindabout5,000piecesof4-inchsubstratepiece.KoreanNTS,JapaneseSHUWA,JapaneseDISCO,TaiwaneseWEC,AmericanENGIS,etc.
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