Thinning grinding wheel
The thinning grinding wheel is widely used in the fields of LED chips, integrated circuit silicon wafers, etc. of the electronics industry, and is mainly used for thinning and grinding of semiconductor wafers.
The processed objects include: discrete devices, integrated circuit substrate silicon wafers, sapphire epitaxial wafers, silicon wafers, gallium arsenide, GaN wafers, silicon-based chips, etc. The application process mainly includes: rough grinding processing and finishing processing of back thinning and front grinding.
Our Company’s thinning grinding wheel specifications:
a). Specifications: diameter 200mm/250mm/265mm/280mm/300mm/380mm, etc.; we can also design and manufacture a variety of single-ring, multi-ring, oblique
tooth thinning grinding wheel according to customer needs.
b). Particle size: 230/270, 270/325, 400/500, 600/700;
c). Ending runout: ≤0.04mm
d). Excircle runout: ≤0.05mm
e). Dynamic balance criteria: G1
The grinding wheel produced by our Company has high processing efficiency, shallow scratch marks, thin grinding damage layer, excellent processing quality, and
long service life, which can reduce the costs of the grinding process by about 30%. At present, our products have replaced the imported products of many
Customer actual usage data:
1. The LN-297D series grinding wheel single sheet matched with the NTS grinder can grind about 18,000 pieces of 2-inch substrate piece, and about 5,000
pieces of 4-inch substrate piece;
2. The LG-255D series grinding wheel single sheet matched with the GALAXY grinder can grind about 2,000 pieces of 4-inch substrate piece;
3. The LS-304D series grinding wheel single sheet matched with the SPEEDFAM grinder can grind about 5,000 pieces of 4-inch substrate piece.
Korean NTS, Japanese SHUWA, Japanese DISCO, Taiwanese WEC, American ENGIS, etc.