Chamfering grinding wheel
Currently in the LED industry, most semiconductor circuits are fabricated on shallow surface layers of sapphire substrate materials. Due to the requirements of the manufacturing process, the high dimensional precision, geometric precision, edge precision, etc. of the wafer are highly demanded. It is usually necessary to chamfer the edge of the wafer before the chip is thinned. This process is often referred to as edge chamfering, and the corresponding equipment is a chamfering machine.
Our chamfering grinding wheel is mainly used for the chamfering of semiconductor wafers. The processed objects include: integrated circuit substrate silicon wafers, sapphire epitaxial wafers, silicon wafers, gallium arsenide, GaN wafers, etc. The application process mainly includes: edge chamfering. Our Company’s grooved wheel specifications: a). Specifications: diameter 53mm/105mm/151mm/202mm, etc.; single-groove, double-groove, multi-groove up to 12 grooves. b) Particle size: 230/270，400/500,500/600 c). Ending runout: ≤0.04mm d). Excircle runout: ≤00.05mm e). Dynamic balance criteria: G1
The grinding wheel produced by our Company can be used for high-speed and high-efficiency grinding, also has long service life and high cost performance, thus can completely replace the imported products. With the high material removal efficiency and high finish, it can reduce the costs of the chamfering process by about 30%. At present, it has been applied in many LED enterprises such as Qingdao iStar-Wafer, Harbin Qiuguan, Daqing Jiachang, TDG Holding, Tangshan Jingyuan Electronics, Nanjing J-crystal, Fujian Jing’an, etc., and recognized by the customers.
Our Company can design and produce all kinds of super-hard grinding wheel products for different use requirements and use environment, and provide you with satisfactory services!