Diamond wire saw product
Brazing diamond wire saw can realize the combination of diamond and solder metallurgy. It has the advantages of high bonding strength, high cutting edge height, large chip space, high cutting efficiency and long service life.It is widely used in cutting hard brittle materials such as silicon chip, silicon ingot, magnetic material, optical glass and gemstone.
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Product name: Diamond wire saw product
Product category: Advanced material technology
Application area: Cutting hard brittle materials such as silicon chip, silicon ingot, magnetic material, optical glass and gemstone
Intro: Brazing diamond wire saw can realize the combination of diamond and solder metallurgy. It has the advantages of high bonding strength, high cutting edge height, large chip space, high cutting efficiency and long service life.It is widely used in cutting hard brittle materials such as silicon chip, silicon ingot, magnetic material, optical glass and gemstone.
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